The agreements include making available its certified AI-driven digital and analogue design flows for Intel’s 18A process node and production-ready EDA flows for the 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery.
Intended to drive multi-die design innovation forward, Synopsys and Intel Foundry are working together to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. EMIB-T combines EMIB 2.5D and Foveros 3D packaging technologies for high interconnect densities at die sizes beyond the reticle limit.
With its EDA flows, multi-die solution, and broad portfolio Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, will enable designers to accelerate the development of highly optimised AI and HPC chip designs.
"Our collaboration with Synopsys enables engineering teams to accelerate 'systems of chips' innovation utilising our foundry capabilities and optimised Synopsys EDA flows and IP on Intel 18A and Intel 18A-P process nodes to create differentiated designs with faster time-to-results," said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry.
Synopsys' digital and analogue design flows are certified for Intel 18A process nodes and is production-ready for Intel 18A-P while its IP and EDA flows are optimised for power and area on the Intel 18A and Intel 18A-P process nodes taking advantage of Intel's PowerVia backside power delivery network enabling thermal-aware implementation for PowerVia based designs.
RibbonFET-driven synthesis and optimisation enable designers to achieve differentiated power, performance, and area (PPA) on Intel 18A and Intel 18A-P process nodes. Synopsys and Intel Foundry are also working on design technology co-optimisation for Intel’s 14A-E to establish the readiness of Synopsys EDA flows for this next generation advanced node.
Synopsys is further expanding its collaboration with Intel Foundry and the ecosystem by joining the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Accelerator Chiplet Alliance.
