Engineering publications brought to you by Mark Allen

Neil Tyler

Embedded Systems

Tria’s latest family of modules now support Windows, Android and Linux

Electronics

Quantum Networking Unit to scale quantum datacentres

Interconnection

Harwin extends Kona range of high-reliability SIL connectors

Communications

Quantum innovation programme drives advanced connectivity in the UK

Automotive

New digital automotive audio amplifiers for smart-cockpit applications

Artificial Intelligence

NVIDIA building industrial AI cloud to support European manufacturing

Electronics

Apple’s WWDC underwhelms

Electronics

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission

Artificial Intelligence

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices

Electronics

sureCore launches comprehensive suite of silicon services for next generation devices

Sensors

LEM releases high-voltage battery sensor that combines shunt and Hall effect technologies

Power

XP Power extends HPT5K0 series with 400VDC and 800VDC model additions