Engineering publications brought to you by Mark Allen

Neil Tyler

Communications

CSignum secures £6m to transform underwater wireless networks

Memory

Samsung set to end DDR4 production in the face of Chinese competition

Automotive

Wayve opens Testing and Development Centre in Japan

Distribution

Challenging times

GPUs

VeriSilicon launches ultra-low power OpenGL ES GPU for wearables

Electronics

Renesas debuts new additions to its RA0 microcontroller portfolio

Interconnection

Back flip FPC connector features staggered contact array for narrow-pitch

Electronics

TSMC remains bullish despite tariff headwinds

Electronics

Cadence to acquire Arm Artisan Foundation IP business

Power

Navitas’ SiCPAK power modules deliver reliability at high temperatures

Power

SemiQ 1200 V SiC MOSFET modules enable more compact, cost-optimised systems

Electronics

JEDEC announces release of the JESD270-4 HBM4 standard