Engineering publications brought to you by Mark Allen

Communications Hardware

AccelerComm unveils latest generation of 5G NR NTN physical layer solutions

Hitek Systems launches eSOM7 development platform for FPGA wireless solutions

EnSilica awarded £10m for satellite broadband terminal chips

RANsemi partners with Antevia Networks to provide silicon for Open RAN radio units

Keysight and University of Malaga unveil 6G Research and Innovation Laboratory

Bluetest and Rohde & Schwarz offer over-the-air testing of next-generation WLAN devices

AI server market to reach $298bn in 2025

Ayar Labs secures $155m with investors including AMD, Nvidia and Intel

Communications Hardware Products

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

Toshiba unveils 4-bit dual-supply bus transceivers to manage UART or SPI interfaces

Infineon and RT-Labs integrate key communication protocols into XMC7000 MCU family

Communications Hardware Features

Private 5G and the UK

Healthcare’s digital transformation

Using AI to build next generation wireless systems