Engineering publications brought to you by Mark Allen

Communications Hardware

xMEMS extends µCooling Technology to AI data centres

Keysight and University of Malaga unveil 6G Research and Innovation Laboratory

Hitek Systems launches eSOM7 development platform for FPGA wireless solutions

AccelerComm unveils latest generation of 5G NR NTN physical layer solutions

RANsemi partners with Antevia Networks to provide silicon for Open RAN radio units

EnSilica awarded £10m for satellite broadband terminal chips

Bluetest and Rohde & Schwarz offer over-the-air testing of next-generation WLAN devices

AI server market to reach $298bn in 2025

Communications Hardware Products

Microchip expands data centre connectivity, storage and compute portfolios

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

Toshiba unveils 4-bit dual-supply bus transceivers to manage UART or SPI interfaces

Communications Hardware Features

Private 5G and the UK

Healthcare’s digital transformation

Using AI to build next generation wireless systems