Engineering publications brought to you by Mark Allen

Semiconductors

Broadcom ships Tomahawk 6, world’s first 102.4 Tbps switch in a single chip

UK Electronics Skills Foundation announces Government funded Semiconductor Skills initiative

Marvell develops advanced packaging platform for custom AI accelerators

Sarcina Technology advances photonic package design to tackle key data centre challenges

Imec demonstrates 16nm pitch Ru lines with record-low resistance

Archer’s gFET biochip integrates with electrical readout circuitry on silicon chip

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

Semiconductors Products

Silicon Labs unveils Series 3 SoCs targeting next generation IoT devices

Microchip presents cost-optimised PolarFire Core FPGAs and SoCs

Renesas extends RZ/A MPU line-up with RZ/A3M for HMI solutions

Semiconductors Features

Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D

The ‘Shift Left’ evolution in analogue mixed signal design

Deploying anti-tamper IP