Engineering publications brought to you by Mark Allen

Semiconductors

POLYN Technology announces first tapeout of NASP chip

Global SiC substrate revenue falls 9% in 2024 although long term demand remains strong

Semidynamics unveils Cervell All-in-One RISC-V NPU

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Imagination announces E-Series GPU IP for graphics and AI at the edge

Infineon’s Dresden fab receives final funding approval from German government

Keysight EDA and Intel Foundry collaborate on EMIB-T silicon bridge technology

Semiconductors Products

Synaptics unveils first Veros Wi-Fi 7 family tailored for the IoT

Microchip introduces MCU family to simplify analogue sensor design

NOVOSENSE introduces highly integrated SoC for automotive lighting systems

Semiconductors Features

The ‘Shift Left’ evolution in analogue mixed signal design

Deploying anti-tamper IP

A Bitter Lesson