Engineering publications brought to you by Mark Allen

Semiconductors

TechWorks and CSC sign MoU to strengthen innovation and collaboration

CEA-Leti and Soitec to leverage FD-SOI to provide enhanced security of integrated circuits

Hexagon launches a new humanoid robot built for industry

X-FAB releases new isolation class within its 180nm XH018 semiconductor process

Texas Instruments announces $60bn US investment

Nordic Semiconductor announces acquisition of Neuton.AI

Applied Materials and CEA-Leti expand joint lab to drive development of specialty chips

NXP and Rimac co-develop centralised vehicle architectures for SDVs

Semiconductors Products

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

Murata presents first resin-moulded thermistor with wire-bonding

Supermicro launches highly optimised AI solutions based on AMD Instinct MI350 Series

Semiconductors Features

Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D

The ‘Shift Left’ evolution in analogue mixed signal design

Deploying anti-tamper IP