Engineering publications brought to you by Mark Allen

Semiconductors

Samsung said to be near to securing 2nm orders

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Global SiC substrate revenue falls 9% in 2024 although long term demand remains strong

Semidynamics unveils Cervell All-in-One RISC-V NPU

Infineon’s Dresden fab receives final funding approval from German government

Location tracking of AI chips aims to curb smuggling

Keysight EDA and Intel Foundry collaborate on EMIB-T silicon bridge technology

Intel’s new manufacturing process attracts interest

CORNERSTONE advances its silicon photonics services with new E-beam lithography capability

Imec to coordinate development of EU Chips Design Platform

EU likely to miss 2030 microchip target