Engineering publications brought to you by Mark Allen

Artificial Intelligence

CELUS leverages next generation of AI intelligence to simplify design process

Miniature AI-enabled sensor for personal electronics and IoT

Siemens deploys AI in new Questa One smart verification solution

POLYN Technology announces first tapeout of NASP chip

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Semidynamics unveils Cervell All-in-One RISC-V NPU

The future of AI runs on the GPU

Imagination announces E-Series GPU IP for graphics and AI at the edge

Location tracking of AI chips aims to curb smuggling

AI - Navigating the ethical and regulatory maze

CELUS Design Platform integrates with Cadence’s OrCAD X Platform