Engineering publications brought to you by Mark Allen

RF & Microwave

NXP unveils third-generation imaging radar processors

NPL successfully trials reconfigurable intelligent surface technology

Imec research highlights GaN-Si’s potential for 5G+/6G communication systems

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

EU invests €6 million in new networks to power factories of the future

Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar

Pragmatic Semiconductor’s flexible chips to revolutionise NFC connectivity

TSMC and MediaTek demonstrate integrated PMU and PA

RF & Microwave Products

Amphenol RF expands its SMA cable assembly portfolio

TI unveils new chips to support advanced vehicle autonomy and safety

EECL offers first off-the-shelf microwave test and measurement solutions

RF & Microwave Features

E-band in space

Private 5G and the UK

Time to Bridge the Terahertz Gap