Engineering publications brought to you by Mark Allen

Electronics

Electrification and beyond

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

NXP and Rimac co-develop centralised vehicle architectures for SDVs

Murata presents first resin-moulded thermistor with wire-bonding

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Singular Photonics and AMS Technologies to bring advanced SPAD sensors to Europe

Quantum Networking Unit to scale quantum datacentres

Quantum innovation programme drives advanced connectivity in the UK

Apple’s WWDC underwhelms

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices

sureCore launches comprehensive suite of silicon services for next generation devices