Engineering publications brought to you by Mark Allen

News

Consumer

Kardome and LG look to transform voice user interfaces with spatial hearing AI

Electronics

Foxconn to open Europe’s first fan-out wafer level packaging plant

Sensors

Archer enters partnership with Paragraf for Biochip development

Medical & Healthcare

Imec presents prototype of ingestible sensor for health monitoring

Automotive

Xiphera partners with Siemens Cre8Ventures to strengthen automotive security

Electronics

Quantum technology agreement signed by EU and Japan

Electronics

Imec and TNO launch Holst Centre Photonics Lab

Electronics

Finwave Semiconductor announces successful $8.2m funding round

Consumer

MediaTek’s Dimensity 9400e mobile platform provides enhanced AI and connectivity

Electronics

Rambus makes chipsets available for next-generation AI PC memory modules

Electronics

CELUS leverages next generation of AI intelligence to simplify design process

Audio Technology

xMEMS unveils thinnest speaker to date, engineered for wearables