Engineering publications brought to you by Mark Allen

Electronics

Microsoft laying off 7,000 workers despite profitable quarters

The ‘Shift Left’ evolution in analogue mixed signal design

CELUS leverages next generation of AI intelligence to simplify design process

Miniature AI-enabled sensor for personal electronics and IoT

xMEMS unveils thinnest speaker to date, engineered for wearables

Siemens deploys AI in new Questa One smart verification solution

Samsung said to be near to securing 2nm orders

POLYN Technology announces first tapeout of NASP chip

Using educational resources to build innovative wireless projects

Keysight expands USB standards support with launch of System Designer for USB

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors