Teradyne brings real-time analysis to semiconductor test flow

2 mins read

Teradyne, a supplier of automated test solutions, has launched the Teradyne Archimedes analytics solution.

This is an open architecture that brings real-time analytics to semiconductor test, optimising test flow and yield, and lowering costs, while reducing the security risks present with cloud-based solutions.

“Demand for higher-quality semiconductor devices that use advanced processes is increasing the complexity of semiconductor manufacturing and only comprehensive test and analytics solutions can help address this,” said Regan Mills, vice president of marketing and general manager, Semiconductor Test Division, Teradyne.

“Offering an open architecture that lets our customers choose the most effective data analytics solutions for their environment, Teradyne Archimedes helps identify failures and their root causes, allowing corrective actions to be taken, both before and during high-volume manufacturing.”

Teradyne Archimedes integrates seamlessly with leading data analytics platforms, speeding time to analysis.

“The challenge of maintaining security and data integrity has never been more critical,” said Uzi Baruch, chief strategy officer, proteanTecs. “The combination of Teradyne Archimedes analytics solution with proteanTecs deep data analytics enables telemetry-based insights that add immeasurable value to semiconductor test. The integration of our ML-driven cloud and edge software into Teradyne’s open analytics development environment delivers a new level of device visibility to meet the surging performance, power and reliability requirements of advanced systems.”

Many of today’s analytics solutions employ diverse data formats, specifications, and interface requirements. Consequently, they require on-tester agents to achieve compatibility with automated test solutions, which significantly increases support and application-engineering costs.

Overhead from this approach, coupled with analytics solutions that also rely on the cloud, may slow down tester operations and expose critical test data. Moving data analytics to the system edge mitigates these vulnerabilities.

By contrast, Teradyne UltraEdge2000, an integral part of the Archimedes analytics solution, is a secure, high-performance, parallel-compute platform that executes real-time analytics solutions with millisecond latency. It can deliver a natively secure environment that performs data consumption and heavy computational processes in real-time at the edge of the network, so reducing exposure to the security risks present with cloud-based solutions and on-tester agents.

Semiconductor test operations on automated test equipment (ATE) have long produced large amounts of data for use during the validation and high-volume manufacturing test processes. Analytics solutions increasingly use this data for real-time analysis on the system edge, ultimately driving real-time ATE input and control to improve test yield, throughput, efficiency, and product quality.

Teradyne Archimedes analytics solution:

  • is a real-time, open architecture that ensures best-in-class solutions are easy to deploy;
  • provides access to a larger set of trusted and consistently structured data types, providing greater flexibility and ensuring data integrity;
  • delivers a bi-directional data stream that enables in-situ, real-time data analytics, pushing learnings back to the tester for immediate test program optimizations that improve quality and yield; and
  • is a natively secure environment that eliminates the need for on-tester agents and their accompanying security risks, enabling test engineers and their analytics solution partners to focus on improvements and optimizations, not on tester-infrastructure maintenance.

“Teradyne Archimedes analytics solution combines Teradyne’s expertise in rigorously testing the vast number of semiconductor devices that power today’s digital devices with the benefits of deep-learning data analytics at the platform edge,” added Mills. “The result saves our customers time and money with total manufacturing-level enhancements.”