Engineering publications brought to you by Mark Allen

ASIC & SoC

Crypto Quantique and Attopsemi to simplify PUF technology implementation

MediaTek unveils the Dimensity 9400 SoC

Efabless presents custom chip platform for Edge ML products

Semiconductor packaging material market set to return to growth in 2024

GlobalFoundries certifies Analog FastSPICE platform for high-performance processes

First silicon-proven 3nm 24 Gbps UCIe subsystem validated

AMD expands automotive-grade FPGAs portfolio

Semiconductor industry to invest $400bn in 300mm Fab equipment

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Renesas develops power-efficient 4th-generation R-Car automotive SoCs

SiFive unveils XM Series to accelerate high performance AI workloads

Qorvo introduces next-generation Matter solution