With chip design becoming increasingly complex with more components, higher performance demands and tighter timelines, this new software package has been developed to help engineering teams work faster and more efficiently. It does this by automating one of the most time-consuming parts of the design process: assembling and reusing existing technology.
“The soaring count of silicon IP blocks, expanding AI compute, scaling of subsystem IPs, and rapid growth of chiplets are all driving unprecedented integration challenges in semiconductor design,” said K. Charles Janac, president and CEO of Arteris. “Magillem Packaging streamlines this complexity, automating IP readiness and assembly to boost productivity and help our partners and customers deliver advanced technologies faster.”
Magillem Packaging enables IP teams to package and prepare hundreds or even thousands of components for integration into a chiplet or SoC, including new, existing or third-party IP blocks. Based on the latest version of the IEEE 1685 (IP-XACT) standard, Magillem Packaging works seamlessly with a broad range of industry tools and silicon IP, helping companies keep up with increasing design demands while reducing costly errors and delays.
Key Capabilities of Magillem Packaging include:
IP Reuse with comprehensive IP, subsystem and chiplet packaging in a reusable format including configuration, implementation and verification for incremental and full packaging with a proven methodology.
Correct-by-construction IEEE 1685-2022 generation without requiring any pre-requisite IP-XACT expertise, while standard compliance and data consistency are ensured by construction and assessed with a built-in Magillem checkers suite.
Scalable and fully automated generation of IP packaging for both reused and new IP blocks, with support for legacy 2009 and 2014 versions of IEEE 1685 standard, with intuitive graphical editors enabling fast viewing and editing of IP block descriptions.
The new software complements the company’s broader suite of products that are currently used by many of the world’s top semiconductor companies.
