Engineering publications brought to you by Mark Allen

Semiconductors

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

TSMC to open its first European Design Centre in Munich in Q3 2025

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU

Are reconfigurable AI ICs the future?

Reports suggest Asahi Kasei plans to cut PIMEL shipments

Global semiconductor CapEx rises 27% in Q1, according to SEMI

GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation

Innatera unveils Pulsar, a neuromorphic MCU for the sensor edge

Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D

TSMC set to build 9 facilities in 2025

Foxconn to open Europe’s first fan-out wafer level packaging plant