Industry leaders join forces to standardise chiplet ecosystem

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Companies from across the semiconductor industry have announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

Advanced Semiconductor Engineering (ASE), AMD, Arm, Google Cloud, Intel, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company have come together to better represent a diverse ecosystem of market segments, that will look to address customer requests for more customisable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

The founding companies also ratified the Universal Chiplet Interconnect Express UCIe specification, which is an open industry standard that’s been developed to establish a ubiquitous interconnect at the package level.

The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols, and software stack which leverage the PCI Express (PCIe) and Compute Express Link (CXL) industry standards.

The specification will be available to UCIe members and available to download on the website.

The founding companies represent a wide range of industry expertise and include leading cloud service providers, foundries, system OEMs, silicon IP providers, and chip designers, and they are in the process of finalising incorporation as an open standards body.

Upon incorporation of the new UCIe industry organisation later this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security, and other essential protocols.