Foxconn has also signed a strategic partnership with Thales in the satellite sector.
According to Foxconn, the OSAT project will use fan-out wafer-level packaging (FOWLP) technology, making it Europe’s first advanced FOWLP packaging and testing facility. The plant will enable Foxconn to establish a local presence and strengthen its global supply chain. Reports suggest that initial sales will focus on the European market, addressing automotive, aerospace, 6G communications, and defence.
In the satellite sector, the partnership with Thales will combine its space technology expertise with Foxconn’s high-tech manufacturing capabilities. According to Foxconn, the goal is to jointly develop high-quality, high-value satellites for large-scale low Earth orbit (LEO) telecommunications constellations.
This move is significant for Foxconn and the group’s Head of B5G Strategy, Jesse Chao, has previously stated that LEO satellites could play a key role in 5G or 6G networks over the next 10 to 15 years. Foxconn is said to be aiming to provide contract manufacturing services in the satellite supply chain through a standardised, industrialised model.
To expand its role in the satellite supply chain, Foxconn and its subsidiaries have partnered with various firms with collaborations said to include a LEO user terminal developed by FIH and Sharp, an Earth observation camera module by Rayprus, and space-grade connectors and cables from FIT.
Foxconn is also actively expanding its electric vehicle business and recently announced that its subsidiary, Foxtron Vehicle Technologies, has signed a memorandum of understanding (MOU) with Mitsubishi Motors Corporation. Under the agreement, Foxtron will handle design and manufacturing management.
