Advanced packaging has become a key R&D priority for the semiconductor industry amid growing demand for artificial intelligence (AI) and other data-intensive applications ranging from high performance data computing and datacentres to 5G / 6G communication and more.
In order to meet these needs, acceleration in advanced packaging technologies will be key to delivering the compact, high-performance and energy-efficient technology solutions needed to drive the industry’s long-term growth.
Under the agreement, A*STAR will provide GF with access to its R&D facilities, capabilities and technical support, while GF will provide critical equipment to A*STAR to further its R&D efforts.
The collaboration will accelerate GF’s plan to develop and ramp its advanced packaging solutions and expand its offerings to provide customers one-stop solutions for semiconductor chips to be manufactured, processed, packaged and tested at GF’s Singapore manufacturing facility.
“With a robust semiconductor ecosystem and strong R&D support from the government and institutions like A*STAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, GF’s Chief Technology Officer. “This aligns to our global advanced packaging roadmap and reinforces our commitment to deliver more energy-efficient essential chips that are crucial for our customers, especially in the AI era.”
This collaboration will see skills enhancement initiatives implemented for GF employees, where they can develop new expertise in the area of advanced packaging - nurturing the next generation of high technology talent, as well as upskilling and retraining talent in tandem with the industry’s evolving needs.
“As Singapore strengthens its position as a critical node in the global semiconductor supply chain, continued R&D collaboration between public research and the industry is essential to drive innovation and maintain our competitive edge. A*STAR looks forward to working closely with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies and become leaders in this domain,” said Terence Gan, Executive Director at A*STAR Institute of Microelectronics (A*STAR IME).
“Our partnership with A*STAR marks yet another milestone for GF in Singapore, as we continue to play our part in growing local capabilities and talent,” said Tan Yew Kong, Senior Vice President and General Manager of GlobalFoundries Singapore. “With growing demand for AI applications, we’re excited to tap into A*STAR’s expertise and infrastructure to fast-track the deployment of new advanced packaging offerings, and most importantly, upskill our workforce. Our joint efforts in R&D and talent development will ultimately spur the continued growth of Singapore’s semiconductor ecosystem as we work towards Singapore’s Manufacturing 2030 vision.”
The MOU with A*STAR follows an earlier announcement by GF in January this year, where the company announced plans to create a new Advanced Packaging and Photonics Center for advanced packaging and testing of US-made essential chips within its New York manufacturing facility.
