Engineering publications brought to you by Mark Allen

Space

EnSilica unveils dual-beam, dual-polarisation Ku-band analogue beamformer chipset

Foxconn to open Europe’s first fan-out wafer level packaging plant

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

Putting the building blocks in place

E-band in space

Companies forge alliance for quantum-secure satellite communications

Frontgrade Gaisler and wolfSSL look to enhance space cybersecurity

EU Project to deliver breakthrough in space imaging sensing

Mouser stocking Apogee Semiconductor's rad-hardened LEO A-Grade ICs

ESA and EnSilica partner to enable fully integrated ASICs for resilient GNSS

AccelerComm unveils latest generation of 5G NR NTN physical layer solutions

Oso Semiconductor raises funds to develop next generation of phased array antennas