Eliyan closes $60mn Series B funding round

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Eliyan, the company credited for the invention of the industry’s most efficient chiplet interconnect, has closed its latest funding round, totalling $60 million.

The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.

According to the company this additional investment follows a $40 million Series A round in 2022 and will enable Eliyan to continue its focus on the design and manufacturing challenges associated with advanced AI chips that use multi-die architectures in either advanced packaging or standard organic substrates.

Its chiplet interconnect technology has enabled chip makers to achieve improved levels of performance and power efficiency.

In addition to die-to-die interconnect in chiplet-based designs, the company is working on the growing challenge of memory capacity and bandwidth in AI chips with its Universal Memory Interface (UMI).

Its bi-directional interconnect method looks to address the ‘memory wall’ issue facing large, multi-die designs. UMI enables a very bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging. Given its highly efficient PHY beachfront area, UMI provides a significant increase in aggregate memory bandwidth per AI chip and major die area reduction needed for memory interfaces.

Eliyan’s NuLink PHY recently taped out on TSMC’s 3nm process, delivered industry-leading performance of up to 64Gbs per link, with what was described as an exceptional performance/power ratio.

Commenting Marco Chisari, Head of Samsung Semiconductor Innovation Center and Executive Vice President, Samsung Electronics, said, “Intensive workloads and cutting-edge applications, including Generative AI and automotive, are driving the demand for more sophisticated semiconductor design and the adoption of chiplet architecture.”

“This investment reflects the confidence in our approach to integrating multi-chip architectures that address the critical challenges of high costs, low yield, power consumption, manufacturing complexity, and size limitations,” said Ramin Farjadrad, co-founder and CEO of Eliyan. “Our NuLink technology has achieved commercial readiness with tape outs in the most advanced processes, and is optimised for delivering the necessary high bandwidth, low latency, and low power capabilities.”