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Siemens deploys AI in new Questa One smart verification solution

Samsung said to be near to securing 2nm orders

POLYN Technology announces first tapeout of NASP chip

Using educational resources to build innovative wireless projects

Keysight expands USB standards support with launch of System Designer for USB

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Global SiC substrate revenue falls 9% in 2024 although long term demand remains strong

QuantWare and Q-CTRL partner to support the deployment of large-scale quantum computers

More than a feeling

Semidynamics unveils Cervell All-in-One RISC-V NPU

Infineon and Visteon working together to advance power conversion systems for EVs