Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Farnell research shows engineers trust AI to select components - up to a point

Power

Toshiba releases 3rd generation SiC MOSFETs with reduced switching losses

Power

Ambient Photonics and e-peas to develop power solutions for connected devices

RF & Microwave

TRIAD streamlines edge processing of data in phased-array antennas

Internet of Things

Winbond and Mobiveil collaborate on ultra-low power applications

Artificial Intelligence

Voxel AI increases funding to $30m with latest strategic funding round

EDA & Design Software

Cadence and Arm to accelerate data centre design using Neoverse V2 platform

ASIC & SoC

QuickLogic unveils customisable eFPGA IP on GlobalFoundries' 12LP process

EDA & Design Software

Zuken unveils enhanced CR-8000 2023 for high-density, high-speed PCB designs

Power

2200V silicon carbide MOSFETs enhance efficiency in challenging applications

Robotics & UAVs

RT choke series mitigates EMI issues in robotics and motor drives

Skills & Careers

Cybersecurity skills shortage requires businesses to 'think outside the box'