Zuken unveils enhanced CR-8000 2023 for high-density, high-speed PCB designs

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Zuken, a specialist in electronic design automation solutions, has announced the availability of the CR-8000 2023.

The 2023 release come with a number of significant enhancements covering the entire design process, empowering users and enabling them to tackle the challenges of high-density, high-speed PCB designs.

Notably, the CR-8000 2023 release places special emphasis on revitalizing and expanding the spectrum of signal integrity, power integrity, and electromagnetic compatibility (EMC) analysis tools. These advancements have been seamlessly integrated into the CR-8000 Design Force Analysis Advance bundle.

"We are excited to unveil CR-8000 Release 2023, which empowers designers to address the ever-increasing demands of high-density, high-speed PCB designs," said Kazuhiro Kariya, Sr. Managing Executive Officer and CTO of Zuken. "Through the strategic enhancements made to our flagship CR-8000 tool suite, we are providing our customers with a comprehensive solution that boosts design efficiency and supports accurate analysis, ultimately enabling them to stay ahead in today's competitive market." 

With the CR-8000 2023 release, Zuken said that it was looking to empower users with tools that simplify the challenges of leading-edge electronic design providing:

  • Streamlined Design Sheet Integration

With the CR-8000 2023 release, the process of generating new designs becomes seamless. Users can merge sheets from diverse designs, enabling the incorporation of various elements or the utilization of template designs as a solid foundation.

  • Enhanced Information Security

Privacy takes centre stage with the introduction of a feature that allows sensitive information exclusion before external sharing. Tailoring resource files to distinct collaboration needs fosters a secure and collaborative design environment.

  • Efficiency through Design Reuse

The 2023 release introduces a new feature that streamlines documentation by enabling the copying, editing, and seamless integration of circuits and text elements. This innovation enhances efficiency by eliminating redundant tasks and allows engineers to focus on design evolution.

  • Reuse Template Routing

Identical areas of components and routing that are common in multi-channel designs can now be placed and routed based on one instance. This function recognizes component and topology similarities and propagates the master instance to the subsequent channels.

  • Expanded Contour Routing

An interactive contour routing feature aligns seamlessly with existing patterns and board shapes, ensuring design harmony and consistency.

  • Analyse Track Configurations

Users can examine the routing of a trace path by visualizing a cross-sectional view that showcases the trajectory across various layers. This capability allows for comprehensive inspection and evaluation of track arrangements, aiding in identifying potential issues and optimizing the design.

Enhanced Bundle and Functionality

The CR-8000 2023 Release consolidates signal integrity, power integrity, and EMI analysis tools into new bundles, with enhanced user interaction, MultiCore CPU support, and compatibility with extensive datasets. AI/ML-assisted modelling and new Power Integrity checks elevate design and analysis prowess.

Comprehensive Signal Integrity Analysis

The new Design Force SI Advance bundle encompasss features from Characteristic Impedance to IBIS AMI SerDes channel analysis. Comprehensive system-level analysis is ensured through the inclusion of IBIS, SPICE, and S-Parameter models in both domains.

Full-spectrum PCB-level EMI and Power Analysis

The Design Force PI/EMI Advance bundle focuses on EMI and Power Supply System Analysis. Critical functions include rapid estimations, integrity features, and an array of analysis tools designed to optimize designs. Capabilities include IC power pin impedance computation, Decap location and parasitic values determination, DC analysis, incorporation of Lossy Transmission Line models considering copper surface roughness, and integration of IBIS, SPICE, and S-Parameter models. Time Domain Reflectometry (TDR) and Eye Pattern analysis enhance design evaluation. A comprehensive HSPICE export and capability to calculate and export S-Parameter Touchstone data add versatility to the toolset.