Engineering publications brought to you by Mark Allen

KP unveils high-performance parabolic antennas

New supercapacitor opens door to better wearable electronics

NXP selects TSMC 5nm process for automotive platform

STMicroelectronics joins Silicon Catalyst

Solving component end-of-life issues for PCB design

Winbond launches HyperRAM WLCSP package

Smart appliances - doubts raised over their value

First CMOS-based SWIR camera

Nexperia announces next generation 650 V GaN technology

Growing hygiene concerns

High density internal AC-DC power supplies

Digi-Key announces global partnership with Truphone