Nexperia offering GaN FETs in compact CCPAK SMD packaging

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Nexperia’s GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.

According to Nexperia, the GAN039-650NTB, a 33 mΩ (typ.) Gallium Nitride (GaN) FET within the CCPAK1212i top-side cooling package, will usher in a new era of wide bandgap semiconductors and copper-clip packaging.

This technology offers a number of advantages for renewable energy applications such as solar and residential heat pumps, and further enhances Nexperia’s commitment to developing the latest component technology for sustainable applications. It is also suited to a wide spectrum of industrial applications such as servo drives, switched-mode power supplies (SMPS), servers and telecom.

Nexperia’s CCPAK surface mount packaging uses Nexperia’s copper-clip package technology to replace internal bond wires. This reduces parasitic losses, optimises electrical and thermal performance, and improves device reliability.

For maximum flexibility in designs, these CCPAK GaN FETs are available in top- or bottom-cooled configurations to further improve heat dissipation.

The cascode configuration of the GAN039-650NTB enables it to deliver superior switching and on-state performance, with a robust gate offering high margins against noise. This feature also simplifies application designs by eliminating the requirement for complex gate drivers and control circuitry, instead allowing them to be conveniently driven using standard silicon MOSFET drivers.

Nexperia’s GaN technology improves switching stability and helps to shrink die size by approximately 24%. In addition, device RDS(on) is reduced to only 33 mΩ (typ.) at 25 °C, with a high threshold voltage and low diode forward voltage.

 “Nexperia recognises that designers of industrial and renewable energy equipment need a highly robust switching solution that can provide excellent thermal efficiency when performing power conversion,” said Carlos Castro, Vice President, and General Manager of the GaN FET business at Nexperia. “This is why Nexperia decided to bring together the exceptional switching performance of its cascode GaN FETs with the exceptional thermal properties of its CCPAK packaging to offer customers a compelling solution.”

Nexperia’s first CCPAK portfolio release is the top-cooled 33 mΩ (typ.), 650 V GAN039-650NTB, and this will be followed with a bottom-cooled variant, the GAN039-650NBB of the same RDS(on).