Kneron KL720 SoC uses a 1Gb LPDDR3 DRAM die from Winbond

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Winbond Electronics, a supplier of semiconductor memory solutions, has revealed that the latest system-on-chip (SoC) from artificial intelligence (AI) start-up Kneron, the KL720, includes a 1Gb LPDDR3 DRAM die from Winbond.

Earlier this year, Kneron launched an AI processor, the KL520 SoC, which combines proprietary software and hardware technologies and is able to achieve very high AI performance while maintaining low power operation. According to Winbond, the KL520, in use today in battery-powered applications such as smart locks and drones, includes a 512Mb LPDDR2 from the company.

Kneron’s KL720 SoC looks to open up a new set of low-power/high-performance applications for AI and machine learning technology, offering a higher maximum output of 1.4 TOPS (Tera Operations Per Second), and performance efficiency of 0.9 TOPS/W.

Winbond’s LPDDR3 DRAM is supplied as a Known Good Die (KGD) and co-packaged with a new Kneron neural processing unit (NPU) in the KL720. Supporting the high throughput and performance efficiency of the KL720, Winbond’s LPDDR3 DRAM offers a maximum bandwidth 8.5GB/s, operates from a dual 1.2V/1.8V supply, and includes power-saving features such as Deep Power-Down mode and a Clock Stop capability.

The KL720 is capable of processing 4K, Full HD or 3D sensor video images in real time to support AI applications such as face recognition in security cameras or gesture control in public kiosks. It can also perform natural language processing, so allows for intuitive speech recognition and eliminates the need for pre-defined keywords. The 1.4 TOPS performance is also fast enough to support concurrent real-time video and natural language processing.

According to Albert Liu, founder and CEO of Kneron, “Winbond’s LPDDR3 offers the best combination of high bandwidth and low power consumption for the demanding new edge AI applications that the KL720 enables. Just as important as the performance of the silicon, however, is the support that Winbond has given us to help us optimise the interface between our NPU and the DRAM.”

Winbond responded commenting that the KL720 had set a new benchmark for performance and efficiency that no other chip manufacturer, even the giants of our industry, were able to match and was "excited to see a new generation of AI-enabled products come to market based on the KL720 with Winbond DRAM inside.".