Winbond unveils industry-first x64 LPDDR3 memory chip

1 min read

Winbond has introduced the world’s first x64 LPDDR3 chip, a fast 2Gb memory which can replace four or more DDR3 devices in the next generation of 8K display panels.

By adopting the new x64 W63BHANQRA, 8K panel manufacturers will be able to benefit from a much smaller board footprint, reduced component count, lower power consumption and lower bill-of-materials (BoM) cost.

The W63BHANQRA high-speed SDRAM is supplied as a 12mm x 12mm dual-die BGA package. It consists of two channels, each of eight banks supporting concurrent operation, and providing a data width of x64 and a maximum data rate of 2133Mbps.

It provides a better solution to the memory bandwidth problem in 8K display panels than 4ea x16 DDR3 devices used in today’s 8K panel designs.

8K panels typically use a legacy 4K display system-on-chip (SoC) supported by an external MEMC (Motion Estimate and Motion Compensation) functional block, which requires its own fast buffer memory. To operate at a standard frame rate of 60Hz with typical 50% compression of the 8K signal, the MEMC block requires total DRAM memory bandwidth of 90Gbps. Currently, this requirement is normally met by four or more x16 DDR3 devices.

Using this x64 LPDDR3 product, however, Winbond can support the 8K panel’s 90Gbps bandwidth requirement with a single device. The space, cost and power savings provided are seen as providing a competitive advantage to manufacturers of 8K TVs, laptop computers, automotive ADAS (Advanced Driver Assistance Systems) equipment and image signal processing systems.

Sierra Lai, Director of the DRAM Marketing Division at Winbond, said: ‘By eliminating multiple external DDR3 devices from the MEMC sub-system in 8K panels, customers can make huge cost and power savings. For laptop computer manufacturers in particular, the space savings offered by the W63BHANQRA make it far more feasible to upgrade display performance to render the latest 8K content, giving consumers a new and exciting capability in personal computing.’

The W63BHANQRA fully complies with the latest version of the JEDEC standard for LPDDR3.

It includes power-saving features such as Partial Array Self-Refresh, Deep Power Down mode and Clock Stop capability.

Based on a double data-rate architecture, the W63BHANQRA features programmable Read and Write latency, and operates over a case temperature range of -40°C to +105°C.