Working with the Trump Administration and with support from other technology companies aiming to onshore critical components of their supply chain, GF’s investment is being seen as a strategic response to the explosive growth in artificial intelligence. This has accelerated demand for next-generation semiconductors designed for power efficiency and high-bandwidth performance across datacentres, communications infrastructure and AI-enabled devices.
GF is collaborating with technology companies including Apple, SpaceX, AMD, Qualcomm Technologies, NXP and GM, who are all committed to reshoring semiconductor production to the US and diversifying their global supply chains.
According to Tim Breen, CEO of GlobalFoundries, the, “The AI revolution is driving strong, durable demand for GF’s technologies – including silicon photonics, as well as GaN for power applications. Meanwhile at the edge, GF’s proprietary FDX technology is well positioned to support AI functionality with low power consumption.”
“GlobalFoundries investment is a great example of the return of United States manufacturing for critical semiconductors,” said US Secretary of Commerce, Howard Lutnick. “Our partnership with GlobalFoundries will secure US semiconductor foundry capacity and technology capabilities for future generations.”
The rapid rise of AI is driving the adoption of new technology platforms and 3D heterogeneous integration technologies. These advanced solutions are seen as essential to meet the exponentially growing requirements for power efficiency, bandwidth density and performance. GF is well placed to exploit its 22FDX and silicon photonics capabilities in production in New York and support the advanced development of differentiated GaN-based power solutions in its facility in Vermont.
GF’s investment builds upon the company’s existing expansion plans in the US, including more than $13 billion to expand and modernise its New York and Vermont facilities and funding for its recently launched New York Advanced Packaging and Photonics Center - the first US-based facility of its kind dedicated to silicon photonics packaging.
GF said that it was committing an additional $3 billion, which includes advanced research and development initiatives focused on packaging innovation, silicon photonics and next-generation GaN technologies.
In aggregate, these investments represent a $16 billion plan to strengthen the domestic semiconductor industry and to accelerate innovation in AI, aerospace, automotive and high-performance communications.
