Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

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Cyient Semiconductors, a custom silicon company based in Hyderabad, and MIPS, have announced a new strategic collaboration.

Cyient and MIPS to develop intelligent power solutions Credit: Cyient

The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in platforms that address the automotive, industrial, and data centre markets.

“As compute systems scale from cloud to the edge, intelligent power delivery is emerging as a key enabler of performance and efficiency,” said Suman Narayan, CEO of Cyient Semiconductors. “Our collaboration with MIPS allows us to bring together embedded intelligence and advanced power architectures in custom silicon platforms built on a scalable, open foundation.”

“The problem of power efficiency and motor control are both real-time compute workloads for which MIPS M8500 microcontrollers are the optimal choice,” said Sameer Wasson, CEO of MIPS. “Building around our best-in-class real-time and control-loop performance and efficiency, Cyient can bring their capability in intelligent power delivery into custom ASIC and ASSP designs to build differentiated solutions that meet our customers unique needs in their target markets.”

Demand for software defined vehicles, data centre infrastructure, and industrial automation is driving growth for custom silicon. Customers can build advanced, differentiated solutions that are easy to program using MIPS advanced processor IP, based on the open RISC-V instruction set architecture, which will now be combined with Cyient’s intelligent power and mixed-signal design expertise.

Targeted applications include motor drive control, intelligent power management, power delivery management, and safety-critical applications, offered as ASSP or ASIC platforms.

According to Cyient and MIPs, OEMs and system integrators will benefit from faster time-to-market, avoiding proprietary lock-ins, and optimised platform cost.