Collaboration looks to reduce semiconductor design timing signoff schedules

1 min read

Cadence Design Systems in collaboration with TSMC and Microsoft has used the cloud to reduce semiconductor design signoff schedules.

The collaboration provides customers with an accelerated path to complete timing signoff by adopting the Cadence Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform. This move to the cloud will enable users, from all vertical markets, to achieve significant productivity improvements without the constraints of on-premise hardware, according to Cadence.

“Semiconductor designers are meeting or exceeding their power and performance requirements using advanced process technology. However, the increasingly complex advanced-node signoff requirements make it challenging to meet tight product schedules,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “Working with Microsoft and Cadence, our cloud alliance has harnessed the scalability of the cloud with Cadence timing signoff solutions to ensure that our common customers can beat their performance goals and accelerate time to market for their silicon innovations.”

Mujtaba Hamid, head of product management, Silicon, Electronics and Gaming at Microsoft Azure added, “Microsoft’s Azure Cloud platform is suited for high-performance-compute (HPC) applications such as silicon design and signoff. We look forward to collaborating with Cadence and TSMC customers on their silicon HPC needs and enabling these customers to deliver the highest quality products and achieve their time-to-market goals.”

Both the Cadence Tempus Timing Signoff Solution and Quantus Extraction Solution feature massively parallel architectures that are optimal for use in the cloud. By utilising distributed signoff technologies, the Tempus Timing Signoff Solution is production-proven in the cloud on large-scale TSMC advanced-node tape-outs.

“Through our continued collaboration with TSMC and Microsoft, we’re making it easy for customers to offload their Tempus Timing Signoff Solution and Quantus Extraction Solution workloads to the cloud and reap the full benefits of our scalable solutions,” explained Dr. Chin-Chi Teng, Senior Vice President and General Manager of the Digital & Signoff Group at Cadence.

The Cadence Tempus Timing Signoff Solution and Quantus Extraction Solution are part of the broader full flow digital suite, which provides customers with a fast path to design closure and better predictability. The CloudBurst Platform provides fast and easy access to Cadence tools and is part of the broader Cadence Cloud Portfolio.