Engineering publications brought to you by Mark Allen

Neil Tyler

ASIC & SoC

PUF solution eliminates the need of enrolment phase

5G

Nokia phone maker HMD looks to set up production in Europe

Distribution

Farnell strengthens distribution agreement with ams OSRAM

Communications

Demonstration of 5G integrated reference design leveraging NXP semiconductors

Automotive

Mercedes teams up with Google

Internet of Things

ST reveals NB-IoT industrial modules with GNSS geo-location capability

Electronics

Infineon presents user-friendly LCC design tool

Electronics

NVIDIA cuts a ‘dash’ in the AI space

EDA & Design Software

IC’ALPS implements demo-chip designed for Weebit Nano’s ReRAM technology

Internet of Things

Qualcomm looks to simplify and accelerate IoT programmes

Embedded Software

IAR Embedded Workbench supports STM32 MCU series

5G

CEVA DSP architecture addresses compute requirements of 5G-Advanced