Engineering publications brought to you by Mark Allen

Neil Tyler

Board Level Design

Parker releases high-flow thermal gel for high-volume applications

Security

IAR elevates code security for embedded applications

ASIC & SoC

SoC extends connectivity with Amazon Sidewalk, Wi-SUN, and proprietary long-range wireless protocols

Communications Hardware

mm Waveguide ‘Horn’ antennas cover broad frequency range

Memory

Infineon and Autotalks to drive next-generation automotive V2X applications

Interconnection

Wire connecting solution replaces manual splicing in harsh environments

Automotive

Delivering universal autonomy

EDA & Design Software

TASKING presents integrated development solution for NXP S32Z and S32E processors

Electronics

eCADSTAR release 2023 improves user experience and productivity

Embedded Systems

Industrial motherboard supports extensive graphics performance

Distribution

Smith opens office in the UK and appoints trading manager

Board Level Design

Semitech’s technology now available as a Click Board from MikroElektronika