Parker releases high-flow thermal gel for high-volume applications

The Chomerics Division of Parker Hannifin has unveiled a new thermal interface gel for manufacturers looking to address the challenges of high-throughput production.

Providing flow rates of up to 100 g/min, the THERM-A-GAP GEL 60HF (‘High Flow’) thermal gel is intended for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units and sensors, and computing components such as CPUs and GPUs.

Parker has optimised this fully cured gel for automated dispensing at various packaging sizes, while retaining properties for easy rework and field repair situations. The paste-like consistency of gel also enables very tightly controlled dispensing and accurate material placement during assembly. Notably, the product requires low compressive force to deflect under assembly pressure, minimising stress on components, soldered joints and PCB leads.

Despite its high flow rate attributes, THERM-A-GAP GEL 60HF delivers improved performance with superior, long-term thermal stability and reliability. A thermal conductivity of 6.2 W/m-K facilitates optimal heat transfer from electronic components to cooling features.

For convenience, users can store and transport this single-component gel at room temperature, while an additional benefit includes no post-cure requirements, further assisting manufacturers with high-throughput production demands.

Parker can also optimise the THERM-A-GAP GEL 60HF package to suit any existing dispensing equipment.