Engineering publications brought to you by Mark Allen

Neil Tyler

Automotive

Murata presents first resin-moulded thermistor with wire-bonding

Electronics

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Distribution

Singular Photonics and AMS Technologies to bring advanced SPAD sensors to Europe

GPUs

Supermicro launches highly optimised AI solutions based on AMD Instinct MI350 Series

Embedded Systems

Tria’s latest family of modules now support Windows, Android and Linux

Electronics

Quantum Networking Unit to scale quantum datacentres

Interconnection

Harwin extends Kona range of high-reliability SIL connectors

Communications

Quantum innovation programme drives advanced connectivity in the UK

Automotive

New digital automotive audio amplifiers for smart-cockpit applications

Artificial Intelligence

NVIDIA building industrial AI cloud to support European manufacturing

Electronics

Apple’s WWDC underwhelms

Electronics

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission