These options include Android, Windows 11 IoT Enterprise, and Yocto Linux which means that the modules can be used for embedded designs in the industrial, medical, agriculture and construction sectors, as well as any embedded application that can benefit from edge computing, machine learning and AI.
At the heart of these modules are Qualcomm Dragonwing processors. With advanced edge AI and seamless networking capabilities, these processors have been designed for speed, scalability and reliability.
As a result, Tria’s new lineup offers a powerful CPU and AI combination at very low power consumption, enabling embedded designs to benefit from higher performance and increased capabilities.
Tria also now provides Microsoft Windows with ARM, allowing a transition from the x86 architecture to ARM with the same OS. This transition was previously not possible, since Windows on ARM was not available.
According to Christian Bauer, Product Marketing Manager, Tria Technologies, “This family of modules is the only one available to offer compatibility with multiple operating systems at a competitive price.”
“With multi-OS support across Tria’s new modules powered by Qualcomm Dragonwing and Snapdragon platforms, customers gain the flexibility of Windows, Android and Linux across our different platforms”, added Douglas Benitez, Senior Director, Business Development, Qualcomm Europe.
The four new Tria offerings are on SMart Mobility Architecture COM (SMARC) standard modules and Open Standard Modules (OSM), designed primarily for industrial automation and robotic applications. They are:
- Qualcomm Dragonwing IQ-615 processor powered modules supporting Linux
- Qualcomm Dragonwing QCS5430 and QCS6490 processors, with a combination of Linux, Android and Windows 11 IOT Enterprise OS
- Qualcomm Dragonwing IQ9 Series processors, supporting Linux
- Snapdragon X Elite processor, supports Windows 11 IOT Enterprise OS
