Engineering publications brought to you by Mark Allen

Semiconductors

Rapidus collaborating with Siemens on 2nm semiconductor designs

Arteris unveils Magillem Packaging for IP blocks and chiplets

Siemens introduces new solutions to support 2.5/3D IC designs

Challenging times

IAR platform upscales embedded software development workflows for Renesas MCU architectures

Imec and Tokyo Electron to accelerate development beyond-2nm nodes

TechWorks and CSC sign MoU to strengthen innovation and collaboration

Texas Instruments announces $60bn US investment

CEA-Leti and Soitec to leverage FD-SOI to provide enhanced security of integrated circuits

US restrictions drive Chinese chip industry consolidation

Applied Materials and CEA-Leti expand joint lab to drive development of specialty chips

NXP and Rimac co-develop centralised vehicle architectures for SDVs