The agreement marks the start of a new five-year phase in their long-standing alliance and will enable then to extend their joint R&D efforts in key areas such as next-generation patterning, advanced logic device processing, future memory development, and 3D integration – all of which are aimed at developing semiconductor nodes beyond 2nm.
Imec and TEL have partnered since 1995 to drive advances in patterning, logic, memory, and 3D integration and their long-standing collaboration has led to key breakthroughs in areas such as High NA EUV lithography, etching, wet processing and deposition.
A standout achievement was the joint development of EUV resist coating track technology, which – thanks to its significantly improved defectivity control – has played a pivotal role in enabling the introduction of EUV technology into production.
Building on this foundation, the renewed partnership will focus on co-developing tools and process technologies to support the next wave of semiconductor scaling. Joint efforts will target High NA patterning technologies, aiming to boost performance through optimised material systems and improved defectivity control, as well as advanced deposition and etch solutions for next-generation CFET devices.
The agreement also reflects a shared commitment to sustainability, with imec and TEL continuing to explore environmentally responsible manufacturing processes for future semiconductor nodes.
“This extended collaboration is another strong example of imec’s commitment to building international R&D partnerships that benefit the entire semiconductor ecosystem. By deepening our alignment with TEL, we can garner valuable insights that will strengthen other flagship initiatives – such as the NanoIC pilot line under the European Chips Act. Hence, this partnership is truly a win-win: it reinforces TEL’s technology leadership while cementing imec’s position as a global hub for advanced semiconductor research – driving innovation well into the next decade,” said Luc Van den hove, CEO of imec.
“This agreement reinforces our commitment to staying at the forefront of innovation while accelerating the development of technologies critical for advanced nodes. By leveraging imec’s expertise in process optimisation and sustainability, we are confident we can deliver solutions that meet the performance and environmental demands of our global customer base,” added Toshiki Kawai, President and CEO of Tokyo Electron.
