These are highly integrated solutions, and represent a significant step forward in compute power, integration, security, and energy efficiency, addressing the growing demands of both line-powered and battery-powered IoT devices.
As smart devices grow more sophisticated and increasingly compact, the need for powerful, secure, and highly integrated wireless solutions is becoming more acute. The Series 3 SoCs deliver advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration.
According to Silicon Labs its Series 1, Series 2, and Series 3 platforms will complement one another in the market and address the full breadth of IoT applications.
The new Series 3 families of SoCs include:
SiXG301: Optimised for line-powered applications
Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and is intended for advanced LED lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability.
Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.
SiXG302: Designed for battery-powered efficiency
Featuring Silicon Labs’ advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current, 30% lower than competitive devices in its class. This makes it suitable for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications.
The SiXG302 is planned for customer sampling in 2026.
The SiXG301 and SiXG302 families will initially include “M” devices for multiprotocol, the SiMG301 and SiMG302, and “B” devices optimised for Bluetooth LE communications, the SiBG301 and SiBG302.
By leveraging the 22 nm process node for all Series 3 devices, Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications and these new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products.
