The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into the module package, reducing the design workload for manufacturers and enabling the miniaturisation of power conversion circuits in OBCs and other applications.
Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need for greater miniaturisation and lighter weight for these applications.
As a consequence, there is a drive to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.
The HSDIP20 features an insulating substrate with enhanced heat dissipation properties that suppresses the chip temperature rise even during high power operation.
When comparing a typical OBC PFC circuit utilising six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules.
As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturisation of power conversion circuits in applications such as OBCs.
Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturisation of applications in both the industrial and consumer electronics fields.
Applications include:
Automotive systems: Onboard chargers, electric compressors and more.
Industrial equipment: EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.
