Engineering publications brought to you by Mark Allen

Automotive

OMNIVISION launches image sensor for automotive driver monitoring systems

Wayve opens Testing and Development Centre in Japan

Back flip FPC connector features staggered contact array for narrow-pitch

ST presents a new generation of memory solutions for automotive microcontrollers

Infineon introduces new generation of energy-efficient IGBT and RC-IGBT devices for EVs

NOVOSENSE introduces highly integrated SoC for automotive lighting systems

TI unveils new chips to support advanced vehicle autonomy and safety

STMicroelectronics presents next-generation automotive NFC readers

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

3D Linear Hall effect sensor simplifies rotary motion and proximity detection

Infineon announces acquisition of Marvell’s Automotive Ethernet business

ZF sees fibre optics as a key technology for future vehicle electrical systems