Engineering publications brought to you by Mark Allen

News

Electronics

Intel begins ‘major’ programme of layoffs and closes automotive unit

Artificial Intelligence

Over 40% of Agentic AI projects could be cancelled by 2027

Distribution

Farnell enhances mission-critical portfolio

Test & Measurement

Liquid Instruments brings Agentic AI to Test and Measurement

Internet of Things

Morse Micro Wi-Fi HaLow technology receives Matter certification

Distribution

TDK selects Arrow as first Pan-European distributor for TDK-Lambda products

Semiconductors

Rapidus collaborating with Siemens on 2nm semiconductor designs

EDA & Design Software

Arteris unveils Magillem Packaging for IP blocks and chiplets

EDA & Design Software

Siemens introduces new solutions to support 2.5/3D IC designs

Internet of Things

Nordic Semi looks to transform connected product development with Memfault acquisition

Wearable Technology

xMEMS delivers first in-frame active thermal management for AI-driven wearables

Embedded Software

IAR platform upscales embedded software development workflows for Renesas MCU architectures