Leveraging Siemens' IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated IC packaging solutions that cover planning and prototyping, all the way to enabling signoff across a broad range of integration technologies including FCBGA, 2.5/3D IC, and others.
“We are providing our customers with highly innovative advanced packaging technology,” said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. “Our collaboration with Siemens enables us to define a certified, production ready EMIB technology reference flow that we can deliver to our customers so that they can design efficiently and effectively.”
With this Intel Foundry workflow, mutual customers will be able to tackle a range of critical tasks including early package assembly prototyping, hierarchical device floorplanning, co-design optimisation, verification of the complete detailed implementation, including signal and power integrity analysis, and Package Assembly Design Kit (PADK) driven assembly verification.
The Siemens technologies incorporated in this reference flow include Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software SI/PI and the Calibre nmPlatform tool including Calibre 3DSTACK software.
