Providing a unique interposer manufacturing service for chiplets connection and close collaboration with top-tier foundry and OSAT suppliers to secure capacity, yield, quality, reliability, and schedule in production, Faraday can provide seamless integration of multi-source dies.
Faraday, which offers flexible business models tailored to each customer's unique 2.5D/3D package project needs, provides flexible and efficient advanced package services for multi-source chiplets, packaging, and manufacturing.
In a long-term partnership with semiconductor foundry UMC and OSAT vendors in Taiwan, Faraday can support custom passive/active interposer manufacturing with TSV, and proficiently managing 2.5D/3D package logistics.
Faraday can also deep dive into package feasibility studies of chiplets and interposers based on the die information including die size, TSV, bump pitch and count, floorplan, substrate, power analysis, and thermal simulation. This comprehensive analysis not only comes up with an optimal package structure for each project in the early stage but also increases the success probability of the advanced package.
“Faraday empowers customers to redefine the possibilities of chip integration,” said Flash Lin, COO of Faraday. “Leveraging our SoC design expertise and backed by a 30-year experience of sustainable supply chain management, we are committed to production quality bearing in mind the exacting demands of the advanced package market.”
