Operating at low power, which is critical for software-defined vehicles (SDV), these transceivers deliver much improved levels of safety for the next generation of intelligent driving systems and data-rich services.
The devices, ENT11100 and ENT11025, are the only PHY transceivers that support 10 Gbps, 5 Gbps, 2.5 Gbps and 1Gbps in the same device to meet the rising data demands of SDV features, including advanced driver assistance systems, autonomy and over-the-air software while simultaneously simplifying thermal design.
“As demands for the vehicle of the future continue to rise, vehicular bandwidth demands rise commensurately,” said Ramin Shirani, Ethernovia co-founder and CEO. “Our PHY family will be integral to making that future vehicle a reality, not only in meeting these rising demands, but doing so while setting a new benchmark for in-vehicle network energy efficiency.”
“Electrification, increasing connectivity demands and the advancement of automated driving functions result in ever increasing requirements on fast and secure data transmission in the vehicle and to the cloud,” explained Andreas Aal at Volkswagen Group. “Ethernovia’s PHY offers energy-efficient, high-bandwidth, low-latency data transmission paired with embedded co-optimised safety and security IP to enable a seamless and holistic architecture transition that paves the way up to future software-defined vehicles.”
The ENT11100 supports both IEEE 802.3ch multi-gigabit 10/5/2.5GBASE-T1 and IEEE 802.3bp 1000BASE-T1.
The ENT11025 can support both IEEE 802.3ch multi-gigabit 2.5GBASE-T1 and IEEE 802.3bp 1000BASE-T1 and is software and pin compatible to the ENT1x100 providing a simple migration path with a single PCB design.
The single port ENT11100 and ENT11025 are now sampling to customers with the quad port devices sampling later this year.
The devices are the automotive semiconductor company’s first in a planned family of products encompassing a holistic hardware and software system for the next generation of centralised vehicle architecture. That will include a high-bandwidth, low-latency switch in the 7nm process currently being developed in strategic partnership with leading original equipment manufacturer Continental.
