The move is intended to help customers developing leading-edge silicon powered by CEVA’s wireless communications and sensing AI IPs targeted at IFS’ advanced foundry processes.
"As part of our IDM 2.0 strategy, IFS is collaborating with leading IP companies like CEVA to create a robust chip design ecosystem that will help our mutual customers deliver leading-edge silicon performance for the most demanding applications," explained Suk Lee, Vice President of Design Ecosystem Technology at IFS. “Our IFS Accelerator IP Alliance ensures that our customers have access to industry-leading technologies such as the portfolio of IPs offered by CEVA that connect, sense, and infer data through a robust chip design ecosystem that ultimately reduces risk, cost and time-to-market.”
Through the Alliance, CEVA will have access to IFS’ process design kits (PDK) for its most advanced process nodes, enabling CEVA IP to be optimised. In addition, CEVA and IFS will collaborate on silicon validation of newly designed IP solutions, enabling CEVA quick and reliable delivery of their latest IPs.
“CEVA has built incredible leadership in wireless communications and sensing AI IPs, reflected in the company’s position as the world’s foremost IP supplier of 5G, Bluetooth, Wi-Fi, UWB and cellular IoT platforms, as well as Neural Processing Unit (NPU) and DSP solutions,” said Iri Trashanski, Chief Strategy Officer of CEVA. “Through our collaboration with Intel Foundry Services and in joining their Accelerator Alliance, we are able to assist our mutual customers to achieve best-in-class performance with their advanced silicon targeted at the most demanding applications in edge AI & compute, 5G, industrial, automotive and more.”
