The Xilinx business will become the Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng. AECG will remain focused on FPGA and Adaptive SoC and embedded product roadmaps for its core markets, now with the additional scale of the combined company and the ability to offer an expanded set of solutions, including AMD CPUs and GPUs.
Commenting AMD CEO Lisa Su said, “The acquisition of Xilinx brings together a highly complementary set of products, customers and markets combined with differentiated IP and world-class talent to create the industry’s high-performance and adaptive computing leader. Xilinx offers industry-leading FPGAs, adaptive SoCs, AI engines and software expertise that enables AMD to offer the strongest portfolio of high-performance and adaptive computing solutions in the industry and capture a larger share of the approximately $135 billion market opportunity we see across cloud, edge and intelligent devices”.
Mario Silveira, corporate vice president EMEA at AMD added, “This is an important day for AMD in EMEA as we join forces with Xilinx, creating the industry’s high-performance and adaptive computing leader. AMD now has the industry’s broadest product portfolio of leadership computing, graphics and adaptive SoC products. We are excited about the incredible opportunities ahead of us to better serve our customers across an expanded set of diverse markets like communications, automotive and industrial, which are the backbones of EMEA countries’ economies.”
The acquisition is seen as providing a number of benefits:
- Increase AMD’s TAM from $80bn to $135bn, expanding AMD’s customer base, and opening up new markets
- Xilinx’s strategic partnerships across wired and wireless communications, automotive, industrial and test, aerospace and defence, broadcast, measurement and emulation, and consumer markets will complement AMD partnerships in the PC and data centre markets.
- Provide incremental scale to AMD’s R&D
- Bring additional capabilities in advanced technology development, including leadership die stacking and packaging technology, chiplet and interconnect technology, AI and domain-specific architectures and best-of-breed software platforms.
- Provide multiple diverse revenue streams across new end markets with long, high-margin product cycles while maintaining AMD’s industry-leading growth.
