Engineering publications brought to you by Mark Allen

News

Embedded Systems

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

Electronics

AMD acquires photonics startup Enosemi

ASIC & SoC

EnSilica establishes new engineering hub in Cambridge

Electronics

TSMC to open its first European Design Centre in Munich in Q3 2025

Electronics

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU

Electronics

TI working with NVIDIA to bring efficient power distribution to AI infrastructure

Electronics

300mm RF silicon interposer platform paves the way for advanced RF and mixed-signal applications

Electronics

Reports suggest Asahi Kasei plans to cut PIMEL shipments

Electronics

EU consortium for edge-AI technologies opens services to external customers

Communications

International research team develop 5G satellite technology to advance global mobile connectivity

Electronics

Global semiconductor CapEx rises 27% in Q1, according to SEMI

Electronics

GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation