Engineering publications brought to you by Mark Allen

Board Level Design

Rapid development platform for thermal imaging and IR sensing

Sensor Fusion and Tracking Toolbox from MathWorks

NVIDIA Jetson AGX Xavier module targets next-gen autonomous machines

ANSYS develops open file format for thermal simulations

Wall mounting kit for EVOTEC enclosures

Samsung's big semi capex spending keeps pressure on competition, says IC Insights

CEA-Leti and Silvaco look to develop innovative SPICE models

DesignSpark Mechanical 3D CAD design software gets an upgrade from RS

Concurrent launches 3U VPX system

Renesas looks to accelerate sensor network gateway design

Beta LAYOUT offers Drag & Drop service

Why is system-in-package (SIP) becoming a more viable option for system design engineers?