The development kit includes a board and pre-qualified sample software provided by TMG. The board has eight IO-Link connecters allowing developers to immediately connect IO-Link slave devices and start the evaluation process. The development kit has been designed to be easy to use and contributes to shorter prototype-to-production process time and helps to reduce the development burden for engineers.
The solution is supported by two CPUs that operate independently and simultaneously with a large built-in SRAM. The eight-port IO-Link Master is controlled by one CPU; the other CPU features an R-IN engine architecture and supports Industrial Ethernet communication to the upper layers, such as PLC, without any external microcontroller, microprocessor, or memory like DDR. Integrating the two CPUs in a small 12mm x 12mm LFBGA package also helps with designing compact PCBs.
Key Features
Strong development environment reduces the system evaluation period by up to six months
- All-in-one development kit makes it easy for users to begin evaluation immediately and accelerate their time to market.
- The board offers rapid prototyping with eight-port IO-Link connectivity and connections to any IO-Link slave device.
- Pre-qualified sample software from partner TMG shortens the traditional time required to move from prototype to mass production.
OptimiSed design for limited space and industrial environments
- 6 MB of on-chip SRAM eliminates the need for external memory.
- Small 12mm x 12mm LFBGA package makes the master solution ideally suited for printed circuit boards in space-constrained industrial applications.
