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Ultra low power MCU design features MRAM

Bluetooth turns 20

Optical interconnect contract signed with 'global tier 1'

How collaborative robots can work alongside humans and offer assistance proactively

TDK buys ultrasonic sensor pioneer

New electrode design could boost supercapacitor performance

Analog Devices presents its embedded-technology offers at Embedded World

IoT apps processor boasts eight RISC-V cores

imec pushes the limits of EUV lithography single exposure for Logic N5 metal layers and sense DRAM applications

TT Electronics to buy Stadium for £45.8m

Qualcomm to use EUV process for next Snapdragon chipsets

Material-based approach gives birth to smaller, higher-performing inductor