Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers

Electronics

Intel goes large with massive new investment in Israel

Artificial Intelligence

Panmnesia presents enhanced AI vector search system

Security

Quantum-resilient cybersecurity memory module

Education

OKdo selected as Micro:bit Educational Foundation global manufacturer and distributor

Sensors

OMNIVISION extends global shutter sensors portfolio for In-Cabin applications

Audio Technology

AONDevices unveils low-latency, customisable edge AI speech enhancement

Automotive

Vitesco Technologies and ROHM sign long-term SiC supply partnership

Embedded & Programmable

Achronix unveils 400 GbE and PCIe Gen 5.0 for SmartNICs

ASIC & SoC

Alphawave Semi expands collaboration with Samsung, adds 3nm connectivity IP

Electronics

Global 300mm fab equipment spending to reach $119bn in 2026

Communications Hardware

Infineon introduces ISOFACE portfolio of digital isolators